reflow造句_reflow例句_reflow用法_V5词典

1. To handle functions with long lines, we use syntax-aware reflow that runs in real time to wrap these long lines the way a programmer would.: 为了处理代码行较长的函数，我们采用开发人员认可的语法识别的断行方式实时分解长代码行。

2. Tombstone is caused by difference in soldering time when the solder paste is melted at opposite ends of the component during heated in a reflow furnace.: 翘曲产生的原因在于焊接时间的不同，也就是部件相对两端的焊膏在回流炉中遇热溶化的时间不同。

3. The syntax-aware reflow we use to wrap long lines is based on the parse trees (abstract syntax trees) for the language, and some other things need per-language customization.: 语法感知的长句断行基于语言的解析树（抽象语法树），其他功能需要各个语言的定制。

4. The fifth part is the research center of countryside labor reflow problems.: 第五部分为我国农村劳动力回流问题研究的落脚点。

5. Strategic alliance with other printer and reflow oven company to cater to the need of the customers for total line solution.: 通过和其他品牌印刷机，回流炉的战略联盟，更好地满足客户整线生产方案的需求。

6. Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.: 回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。

7. Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven .: 本发明提供一种用来将汽化的焊剂从回流焊接炉的气体中过滤出来的方法和焊剂管理系统。

8. Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package, PCB design, solder paste print, place BGA, and reflow soldering process.: 从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。

9. This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.: 该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。

10. Please follow "Reflow Soldering Conditions" in catalogue.: 请遵守产品目录中的回流焊条件。

11. There exists universally reflow in the entrance of excavated dock, which is similar to approach channel of low head hydro- junction located in alluvial river.: 挖入式港池口门附近普遍存在回流运动，与此类似的情况是冲积河流低水头枢纽的引航道。

12. Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.: “竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。

13. The selection of under bump metal(UBM), the reflow and quality control of bumping are described.: 描述了凸点下金属（UBM）层的选择，凸点回流技术，以及凸点的质量控制技术；

14. Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30 minutes must be layout between each time.: 推荐回流焊只进行一次，回流焊次数如果需要二次，必须相隔30分钟以上；

15. Flow Document capability enables automatic support to reflow content within an application depending on the window size, content semantics, and device resolution of the application.: FlowDocument的功能对随窗口大小，内容语义(semantics)，以及应用的设备分辨率之不同而重新流动内容提供了自动支持。

16. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.: 在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。

17. Smt Reflow Oven, Lead Free Wave Soldering Machine, Components forming Machine, Reflow Tracker, Lead Wire Cutter Cutting Tools, Broaches and Cutters.: 采购产品表面贴装回流焊炉，无铅波峰焊接机，元件成型机，回流焊跟踪，引线刀具切削刀具。

18. We want to buy Smt Reflow Oven, Lead Free Wave Soldering Machine, Components forming Machine, Reflow Tracker, Lead Wire Cutter Cutting Tools, Broaches and Cutters.: 我们要采购表面贴装回流焊炉，无铅波峰焊接机，元件成型机，回流焊跟踪，引线刀具切削刀具。

19. Do not inhale the vapor during reflow.: 不要吸入回流焊时喷出的蒸气。

20. Small chip components may have "tombstone" problems during reflow process by the solder paste.: 小芯片部件在利用焊膏进行回流焊时会出现“翘曲”现象。

21. As absorbed water vaporise in reflow, internal cracks and failures may be created.: 由于水蒸发吸收的回流，可能会产生内部裂纹和失败。

22. Design stencil according to requirement of inserter soldering quality and reflow soldering technology.: 根据插件焊接质量的要求，按照回流焊工艺设计印刷模板。

23. Design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.: 在设计插件回流焊印刷模板时，应尽可能设计成普通模板以简化工艺流程和满足较好的印刷效果。

24. The base of Steam-cabinet is designed in slope, so the condensed water and vapour can flow away and without reflow efficiently.: 蒸柜底部采用斜坡的设计，有效地将蒸柜蒸煮过程中的冷凝水排出柜外，无回流水现象。

25. The successful use of the total process to control tin reflow discoloration and whisker behaviour on connectors in a production environment is described.: 本文详细阐述一个完备的生产过程，它能有效地控制连接器表面锡的回流变色和锡须形成的问题。

26. This change may be further deteriorated with size enlargement of no-reflow area.: 随着无复流面积的扩大，这种变化有进一步恶化的趋势。

27. Forms a flat top making them suitable for automatic placement and reflow.: 形成了一个平顶使其成为自动贴装和回流合适。

28. Because of the computation costs associated with each reflow, most browsers optimize the reflow process by queuing changes and performing them in batches.: 因为计算量与每次重排版有关，大多数浏览器通过队列化修改和批量显示优化重排版过程。

29. The reflow process relies on the temperature profile setting.: 回流过程依赖于温度曲线的设定。

30. The reflow process relies on the temperature profile setting.: 回流过程依赖于温度曲线的设定。

31. parallel gap reflow soldering: 平行间隙回流焊接

32. reflow of corporate sales income to the banking system: 销货款回笼

33. ORS Over Reflow Soldering: 再流回焊接，SMT元件的焊接方式

34. immersion reflow soldering: 浸流焊接

35. Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?: 回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?

36. reflow soldering: 回粮接

37. The most obvious is the necessity for increased reflow temperature.: 最明显的是，使用无铅锡膏必须提高回流焊温度。

38. The reflow process relies on the temperature profile setting.: 回流过程依赖于温度曲线的设定。

39. Reflow Hot Air Furnace: 热风式回焊炉

40. vapor phase solder reflow: 汽相焊料回流

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